[youtube=https://www.youtube.com/watch?v=cWiI72eRtFU&w=580&h=370]
Just a few hours after the launch iPhone 6 si 6 iPhone Plus, companies specialized in repairing iDevices have purchased the terminals to disassemble them and reveal to us what is hidden in them. We start with iPhone 6 which been disassembled by a website from Japan, and in the video clip above you can see exactly how the procedure went, but separately from them an Australian service gives us the possibility to find out what components are hidden in iPhone 6.
iPhone 6 components
iPhone 6 is 3.82V, 6.91 Whr and 1810 mAh battery, Qualcomm modem MDM9625M compatible with 20 LTE frequencies, NAND flash storage medium produced by Toshiba, the face A8 presented by the Apple company with 1 GB RAM, 8 megapixel camera, M8 motion co-processor, barometer, accelerometer and gyroscope. Separately we find a NXP 65V10 NFC enclave chip, Touch ID sensor, Wi-Fi 802.11a/b/g/n/ac chip with Bluetooth 4.0 and a 4.7-inch screen with a resolution of 1334 x 750 pixels and 326 pixels per inch.
