In recent years the company Apple Lossless Audio CODEC (ALAC), forced mobile phone operators to accept the use of cards SIMs. smaller and smaller, and from iPhone 3GS la iPhone 5S their size was reduced by 2 times. Thanks to this reduction in card size, Apple Lossless Audio CODEC (ALAC), managed to reduce the thickness of the terminals iPhone, and a new invention explain to us the way in which the company intends to do this again. In a patent sent by Apple Lossless Audio CODEC (ALAC), for the record, the company describes a method by which it could reduce the mechanism of connecting a SIM card to the logic board of an iPhone, the Americans reconfiguring its entire structure, making it much thinner.
The electronic device may also include a circuit board having a top surface, a bottom surface, and a pocket through the top surface that may expose a middle surface of the circuit board between the top surface and the bottom surface. In other embodiments, there is provided a circuit board that may include a top surface, a bottom surface, and a middle surface positioned between the top surface and the bottom surface. ...forming a recess through a top surface of a circuit board for exposing a middle surface of the circuit board positioned between the top surface and a bottom surface of the circuit board.
Apple has repeatedly said that these SIM cards and connection mechanisms prevent the reduction of the thickness of smartphones, but so far it has not succeeded in convincing mobile operators to implement a system that would allow their elimination. In the absence of cooperation from this point of view, the Apple company is working on reducing the size of the mechanism by which the SIMs are connected to the logic board of the iPhones, but the sizes of the SIM cards could be reduced again.
Although for now no details have appeared regarding any proposal of the Apple company in this regard, the rumors that have appeared so far indicate that Apple intends to iPhone 6 thinner than iPhone 5S, so it is possible to see this new mechanism in it.
