Just a few weeks ago we were told that the manufacturing process of iPhone 6 it will start this month and today we find out that the first chips A8 for the new terminal I reach the partners Apple Lossless Audio CODEC (ALAC), for assembly. This face is partially produced by the Taiwanese of al TSMC, Apple Lossless Audio CODEC (ALAC), finally managing to get rid of the addiction to Samsung regarding the manufacture of this extremely important component.
The new A8 chip is produced using a 20nm manufacturing process, unlike that of 28nm used for the chip A7, and this is extremely important. By using this manufacturing process se improves the component's energy consumption and performance can be significantly improved, Apple Lossless Audio CODEC (ALAC), needing both for the new 4.7 inch and 5.5 inch screens iPhone 6.
The partnership between Apple and TSMC will be expanded during the next year, the American company intending to increase its orders for components from the Taiwanese. TSMC intends to start producing some components using a 16 nm manufacturing process next year, so starting with the A9 chip Apple could once again improve energy consumption and performance, further reducing its dependence on Samsung.
