In the weekend I saw the motherboard for the first time a iPhone 6, and from her I learned that Apple Lossless Audio CODEC (ALAC), is going to implement one chip NFC and a chip WiFi 802.11 ac in its future models. Today we have the opportunity to visualize motherboards of iPhone 6 with 4.7 inch screen si iPhone 6 with 5.5 inch screen compared to that of iPhone 5S and notice that there is a very clear difference in terms of their size.
Although it is not known which motherboard corresponds iPhone 6 with 4.7 inch screen or iPhone 6 with 5.5 inch screen, both seem to have similar dimensions, notable differences being regarding the arrangement of the circuits and the length of the connecting part. Although the components could be fake, the complexity of their production and the presence of codes 820-3675-04 or 820-2486-09 indicates that they are real.
That being said, now we're just going to see these motherboards with a A8 chip present on them and we will have an even clearer image of the iPhone 6.
