In iPhone 6 si 6 iPhone Plus the company Apple Lossless Audio CODEC (ALAC), implemented a A8 chip which contains the main components on which the terminals work, iPhone 5S, iPad Air si iPad Mini with Retina Display operating with the help of a chip A7. After disassembly iPhone 6 si 6 iPhone Plus, those from Chipworks managed to scan the new chip designed by the company Apple Lossless Audio CODEC (ALAC), and identify the processor, RAM, graphics card and more.
The A8 chip from iPhone 6 si 6 iPhone Plus it is 15% smaller than the chip A7, includes 2 billion transistors, and a multitude of interesting surprises. In face we find the same 1 GB RAM, but Apple has implemented 4 MB L3 cache for the cores of the processor, it being divided on each core separately, placed a graphics card PowerVR GX6450 GPU, the M8 motion co-processor, the enclave chips for touch ID si Apple Pay, but not only that.
This A8 chip it is produced using a 20nm manufacturing process, with the Taiwanese company TSMC being the one assembling it, despite the fact that it was rumored that Samsung would produce 40% of the units. Other details about the hardware of the two new iPhones you can read here.
