The first alleged sketch of the iPhone 6S and iPhone 6S Plus motherboard it was published today on the Internet by an Asian source from a factory of a partner of the Apple company, and in this article you can see it in detail.
Although we are talking about an alleged image with a sketch for the iPhone 6S and iPhone 6S Plus motherboard, what is described in the images seems to resemble quite well the component that the Apple company uses for its iPhone terminals released on the market.
Based on the details in these images, the motherboard sketch a iPhone 6S si 6S iPhone Plus would reveal the fact that the A9 chip would have integrated the modem used in future terminals, but also the chip for managing the energy that reaches all the components of the terminal.
The outline of the iPhone 6S motherboard appears in the first images
Separate from the above, the iPhone 6S and iPhone 6S Plus motherboard sketch reveals that the new A9 chip is 15% smaller than the A8 chip used in the iPhone 6 and iPhone 6 Plus, and this is normal with considering the use of a new manufacturing process.
Finally, if the images are indeed true, then this sketch of the iPhone 6S and iPhone 6S Plus motherboard would reveal the fact that the new terminals will be available in versions with 16, 64 and 128 GB of storage space, just like during last year.
The latest rumors claimed that The iPhone 6S will have at least 32 GB of storage space, but they were not based on any document to support them, but only details from sources inside Apple's partner companies, so anything is possible at the moment.
Having said that, the sketch of the motherboard of the iPhone 6S and iPhone 6S Plus reveals some details about the future terminals, but only if they are really real.
