Intel 3D xpoint brings memories 1000 times faster than NAND flash ones, the American company claiming that the durability of its new components is much higher than that of the memories used in current mobile terminals and not only that.
Developed by Intel and Micron, 3D XPoint it represents the first new memory launched in the last 25 years, it being 10 times denser than the current DRAM chips used in computers, this allows data to be stored closer to the processor for faster access.
3D XPoint it offers much better performance for smartphones and tablets, and to begin with the two companies will launch modules with 128 GB of storage space, so the technology is well thought out enough to work in high capacity storage environments from the very beginning.
The innovative, transistor-less cross point architecture creates a three-dimensional checkerboard where memory cells sit at the intersection of word lines and bit lines, allowing the cells to be addressed individually. As a result, data can be written and read in small sizes, leading to faster and more efficient read/write processes.
Apart from the much better performance, the technology 3D XPoint would be able to allow financial institutions to detect fraud much more easily, while research projects should be able to be carried out more quickly through more efficient real-time data analysis.
For now, no one knows how much the 3D XPoint technology will cost when it is launched at the end of this year, but Intel and Micron will make it available to a select number of customers, so we can understand that it will be very expensive when it appears.
In this idea, it could be a very long time before 3D XPoint could reach consumer products, although there is a good chance that Apple and other big companies will want to implement it quickly.
