In the morning I presented you with the partial results of a disassembly made for 7 iPhone Plus by iFixit, and now they come with new, somewhat separate information. Those from iFixIt managed to disassemble the logic board of the iPhone 7 Plus, and there they found the new A10 Fusion chip in which there is 3 GB of DDR 4 RAM manufactured by the Koreans from Samsung.
According to those who disassembled the terminal, the new A10 Fusion chip is extremely thin compared to those used in previous versions of the iPhone, iPhone 7 having one with 2 GB RAM DDR 4. The new A10 Fusion chip is manufactured by TSMC using InFO technology, and that is why it is so thin, the Taiwanese receiving exclusivity in production just thanks to this benefit.
Apart from these, the Apple company uses an Intel XMM7360 modem chip in some GSM models, while others have Qualcomm chips implemented. Separately, Intel provides two SMARTi 5 chips for data transmission, but also a chip that manages the energy flow that reaches the battery and components.
iPhone 7 and iPhone 7 Plus have 4 Intel components
Basically, we are talking about 4 Intel components that are integrated in the iPhone 7 and iPhone 7 Plus, although until now it was known that only one modem chip will be used by Apple. This change suggests that this collaboration between Intel and Apple is much more extensive than initially thought, and this puts pressure on many other partners.
"W]hatever node is being used, the A10 processor is incredibly thin, giving credibility to the reports that TSMC's InFO packaging technique is being used. The A10 sits below the Samsung K3RG1G10CM 2-GB LPDDR4 memory. This is similar to the low power mobile DRAM as the one we found in the iPhone 6s. Looking at the X-rays we see the four dies are not stacked, but are spread out across the package. This arrangement keeps the overall package height to a minimum. Assembled in a package-on-package assembly with the A10 InFO packaging technique reduces the total height of PoP significantly."
With so many Intel components implemented by Apple in the iPhone 7 and iPhone 7 Plus, we can expect that in the future the collaboration will also include other components. Considering that many said that Apple will also manufacture processors with Intel and TSMC in the future, and considering what we see now, anything becomes possible.
