After weeks upon weeks of speculation regarding the name of the company chosen by Apple Lossless Audio CODEC (ALAC), to manufacture the future A9 chip al iPhone 6S, today we find out what those from Cupertino have decided. According to reliable close sources Apple Lossless Audio CODEC (ALAC), si Samsung, the Koreans will produce the future A9 chip of iPhone 6S using a manufacturing process of 14nm FinFET. Although now Apple is mainly dependent on TSMC to manufacture the current chips A8 but by iPhone 6 si 6 iPhone Plus, for next year the Apple company wants more stability and higher production capacity, so it chose Samsung.
That's because Samsung holds a technological edge over TSMC when it comes to the latest manufacturing process. Samsung has managed to shrink the size of the transistors on its chips to 14 nanometers — effectively packing more processing power into a smaller space and consuming less power. TSMC is still at 20 nanometers.
Samsung managed to perfect its manufacturing process of chips for mobile terminals, reducing the size of transistors, so that it has a major technological advantage over TSMC. At the moment, the Taiwanese from TSMC still use a 20nm manufacturing process for the production of processors dedicated to mobile terminals, so Apple cannot contract them. Future A9 chips for the iPhone 6S will be more energy efficient and faster, all thanks to the manufacturing process of 14nm FinFET.
